Patent Assignment
Reel/Frame 062277/0733
Assignment of Assignor's Interest
Recorded: 2023-01-05
Pages: 4
Assignors
CHENG, HAO-WEN
Executed: 2022-12-28
YEN, MING-HUEI
Executed: 2022-12-28
LI, WEN-JIN
Executed: 2022-12-28
GUAN, YU-TING
Executed: 2022-12-28
WANG, DING-SHIANG
Executed: 2022-12-28
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 310401, TAIWAN
Covered Property
(1)
Method of Performing Selective Etch on Array Substrate
Application:
18/090,505 →
Publication:
US 2024/0217868