Patent Assignment
Reel/Frame 062279/0739
Assignment of Assignor's Interest
Recorded: 2023-01-05
Pages: 5
Assignors
LIU, CHUNG-SHI
Executed: 2022-09-27
CHANG, MAO-YEN
Executed: 2022-09-27
LAI, YU-CHIA
Executed: 2022-09-27
PAN, KUO-LUNG
Executed: 2022-09-27
TSAI, HAO-YI
Executed: 2022-09-27
HSIEH, CHING-HUA
Executed: 2022-09-27
LIN, HSIU-JEN
Executed: 2022-09-27
TENG, PO-YUAN
Executed: 2022-10-07
WU, CHENG-CHIEH
Executed: 2022-09-27
LIAO, JEN-CHUN
Executed: 2022-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method