Patent Assignment
Reel/Frame 062279/0887
Assignment of Assignor's Interest
Recorded: 2023-01-05
Pages: 4
Assignors
HSU, WEN-I
Executed: 2022-10-19
CHEN, HSIN-HUNG
Executed: 2022-10-19
YAUNG, DUN-NIAN
Executed: 2022-10-19
LIU, JEN-CHENG
Executed: 2022-12-21
HUNG, FENG-CHI
Executed: 2022-10-19
KUO, WEN-CHANG
Executed: 2022-10-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Isolation Structure with Multiple Components to Increase Image Sensor Performance