Patent Assignment
Reel/Frame 062284/0399
Assignment of Assignor's Interest
Recorded: 2023-01-05
Pages: 5
Assignors
YANG, HAO-LIN
Executed: 2022-12-13
HUANG, KUAN-CHIEH
Executed: 2022-12-11
HSU, WEI-CHENG
Executed: 2022-12-13
WANG, TZU-JUI
Executed: 2022-12-11
WANG, CHEN-JONG
Executed: 2022-12-13
YAUNG, DUN-NIAN
Executed: 2022-12-13
CHEN, YU-CHUN
Executed: 2022-12-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding Structures for Stacked Image Sensor
Application:
18/150,417 →
Publication:
US 2024/0079434