Patent Assignment
Reel/Frame 062291/0453
Assignment of Assignor's Interest
Recorded: 2023-01-06
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same
Application:
18/150,853 →
Publication:
US 2024/0038627