Patent Assignment
Reel/Frame 062296/0954
Assignment of Assignor's Interest
Recorded: 2023-01-06
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same
Application:
18/151,040 →
Publication:
US 2024/0105530