Patent Assignment
Reel/Frame 062297/0653
Assignment of Assignor's Interest
Recorded: 2023-01-06
Pages: 5
Assignors
WANG, CHUEI-TANG
Executed: 2022-12-13
CHANG, TSO-JUNG
Executed: 2022-12-08
LIN, SHIH-PING
Executed: 2022-12-14
HSIEH, JENG-SHIEN
Executed: 2022-12-08
LIN, CHIH-PENG
Executed: 2022-12-08
CHEN, CHIEH-YEN
Executed: 2022-12-08
YU, CHEN-HUA
Executed: 2022-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Stack Structure with Conductive Plug and Method for Forming the Same