Patent Assignment
Reel/Frame 062303/0671
Assignment of Assignor's Interest
Recorded: 2023-01-06
Pages: 10
Assignors
CAO, KANYU
Executed: 2022-09-27
LEE, TZUNG-HAN
Executed: 2022-10-10
LIU, CHIH-CHENG
Executed: 2022-10-10
YANG, HUAIWEI
Executed: 2022-09-22
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, HEFEI CITY, ANHUI PROVINCE, 230601, CHINA
Covered Property
(1)
Semiconductor Structure Comprising Storage Chip Bonded with Control Chip and Method for Forming Same
Application:
18/151,360 →
Publication:
US 2023/0389288