Patent Assignment
Reel/Frame 062311/0254
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 4
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Chip Stacking with an Auxiliary Circuit Chip on a Backside Illuminated (Bsi) Surface of an Image Sensor Chip
Application:
18/151,595 →
Publication:
US 2024/0234471
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293
Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →