Patent Assignment
Reel/Frame 065566/0488
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293
Recorded: 2023-11-14
Pages: 7
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-11-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(55)
Current Sense Circuit Having a Temperature Compensated Response
Application:
18/149,331 →
Publication:
US 2023/0221356
Microlens Structures for Semiconductor Device with Single-Photon Avalanche Diode Pixels
Chip Stacking with an Auxiliary Circuit Chip on a Backside Illuminated (Bsi) Surface of an Image Sensor Chip
Application:
18/151,595 →
Publication:
US 2024/0234471
Backside Metal Patterning Die Singulation System and Related Methods
Optical Devices Including Glass Cover with Patterned Antireflective Coating
Application:
18/153,267 →
Publication:
US 2024/0234456
Semiconductor Device Modules
Current Sharing Mismatch Reduction in Power Semiconductor Device Modules
Substrates and Related Methods
Methods for Mitigating Lag in Image Sensor Devices
Fast Device Reinitialization on DSI3 Bus
Jet Impingement Cooling for High Power Semiconductor Devices
Single Switch Direct Cooling Assemblies and Related Methods
Application:
18/165,504 →
Publication:
US 2024/0266252
Semiconductor Packages with Wettable Flanks and Related Methods
Jet Impingement Heatsink for High Power Semiconductor Devices
Jet Impingement Cooling with Bypass Fluid Portion for High Power Semiconductor Devices
Methods and Systems of Power-Factor-Correction Converters
Semiconductor Device Having a Super Junction Structure and Method of Manufacturing the Same
Application:
18/169,780 →
Publication:
US 2023/0197775
Vertical Shielded Gate Accumulation Field Effect Transistor
Application:
18/171,029 →
Publication:
US 2023/0352577
Sic Mosfet Semiconductor Packages and Related Methods
Image Sensor with a Bond Pad
Protection Dam for a Power Module with Spacers
Application:
18/172,904 →
Publication:
US 2024/0282668
Semiconductor Devices with Single-Photon Avalanche Diodes and Hybrid Isolation Structures
Molded Thin Semiconductor Die Packages and Related Methods
Application:
18/175,079 →
Publication:
US 2024/0290736
Locally Unique Mac Address Resolution
Through-Substrate via Structure and Method of Manufacture
Sintering Film Frames and Related Methods
Application:
18/179,072 →
Publication:
US 2024/0304596
Optical Sensor Package
Application:
18/179,744 →
Publication:
US 2024/0304639
Multiphase Power Converter with Clc Resonant Circuit
Image Sensor Signal Path Routing
Discrete Dual Pads for a Circuit
Application:
18/181,950 →
Publication:
US 2024/0304529
Power Device with Graded Channel
Transistor Device Having a Source Region Segments and Body Region Segments
Method and System of Reducing Total Harmonic Distortion of Power-Factor Correction Converters
Integrated Substrates and Related Methods
Application:
18/182,552 →
Publication:
US 2024/0120253
MIPI C-PHY and D-PHY Interface with Shared Driver, Equalization, and Data Path Circuitry
Nanophotonic High Dynamic Range Sensor Pixel
Chopper-Stabilized Amplifier
Full Ag Sinter Discrete Premium Package
Application:
18/185,514 →
Publication:
US 2024/0312855
Edge Seals for Semiconductor Devices
Application:
18/185,548 →
Publication:
US 2023/0361139
Heat Transfer for Power Modules
Application:
18/186,842 →
Publication:
US 2023/0230895
Insulated Gated Field Effect Transistor Structure Having Shielded Source and Method
Power Adapters with Multiple Charging Ports
Transfer Molded Power Modules and Methods of Manufacture
Image Sensor Amplifiers with Reduced Inter-Circulation Currents
Semiconductor Package Having Wettable Flanks and Related Methods
Application:
18/193,847 →
Publication:
US 2024/0332135
Thinned Semiconductor Package and Related Methods
Inductive Angular Position Sensor
Single Side Direct Cooling (SSDC) Device
Application:
63/455,822 →
Power Module
Application:
63/481,735 →
High Dynamic Range Image Sensor Pixels with Reduced Flicker and Motion Artifacts
Application:
63/481,860 →
Distance Measurement in Ultrasonic Parking Assist Sensors
Application:
63/482,183 →
Ultra-Sonic Sensing in Variable Thermal Conditions
Application:
63/482,188 →
Multi-Sensor Adas System
Application:
63/482,193 →
Driver Monitoring and/or Rear Seat Occupancy Detection Using Ultrasonic Sensor
Application:
63/483,229 →
Adaptive Voltage Scaling with Body Biasing
Application:
63/489,037 →
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2023
From: DUFFY, THOMAS PATRICK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062267/0247 →
Assignment of Assignor's Interest
Jan 4, 2023
From: SULFRIDGE, MARC ALLEN; BORTHAKUR, SWARNAL; CHAPMAN, NATHAN WAYNE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062272/0142 →
Assignment of Assignor's Interest
Jan 9, 2023
From: GEURTS, TOMAS; BORTHAKUR, SWARNAL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062311/0254 →
Assignment of Assignor's Interest
Jan 11, 2023
From: HSIEH, YU-TE; LIN, YUSHENG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062349/0182 →
Assignment of Assignor's Interest
Jan 11, 2023
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062346/0514 →
Assignment of Assignor's Interest
Jan 17, 2023
From: JEON, OSEOB; IM, SEUNGWON; PAUL, ROVEENDRA; TEYSSEYRE, JEROME
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062398/0520 →
Assignment of Assignor's Interest
Jan 23, 2023
From: JEON, OSEOB; IM, SEUNGWON; THIRUKOLURI, RAJANI KUMAR; PAUL, ROVEENDRA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062448/0646 →
Assignment of Assignor's Interest
Jan 27, 2023
From: PRAJUCKAMOL, ATAPOL; CHEW, CHEE HIONG; YAO, YUSHUANG; NG, VEMMOND JENG HUNG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062508/0878 →
Assignment of Assignor's Interest
Feb 1, 2023
From: HUSTAVA, MAREK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062562/0095 →
Assignment of Assignor's Interest
Feb 6, 2023
From: GALLOWAY, JESSE EMMETT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062598/0287 →
Assignment of Assignor's Interest
Feb 7, 2023
From: LER, HUI MIN; KHOR, SWEE HAR; CHANG, ZIMING; LAU, KOK YANG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062614/0674 →
Assignment of Assignor's Interest
Feb 7, 2023
From: COWLEY, NICHOLAS PAUL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062615/0500 →
Assignment of Assignor's Interest
Feb 7, 2023
From: JEON, OSEOB; KO, YOUNGSUN; LEE, YOONSOO; WON, BOSUNG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062613/0821 →
Assignment of Assignor's Interest
Feb 13, 2023
From: YUN, CHANGSUN; JEON, OSEOB
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062670/0442 →
Assignment of Assignor's Interest
Feb 13, 2023
From: MOOKKEN, JOHN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062672/0536 →
Assignment of Assignor's Interest
Feb 15, 2023
From: FAIRCHILD KOREA SEMICONDUCTOR LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062762/0343 →
Assignment of Assignor's Interest
Feb 15, 2023
From: LEE, JAE-GIL; KIM, JIN-MYUNG; LEE, KWANG-WON; KIM, KYOUNG-DEOK
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 062712/0989 →
Assignment of Assignor's Interest
Feb 15, 2023
From: EUM, HYUNCHUL; CHUN, GIYOUNG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062711/0481 →
Assignment of Assignor's Interest
Feb 17, 2023
From: MOENS, PETER; PADMANABHAN, BALAJI; PROBST, DEAN E.; VENKATRAMAN, PRASAD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062734/0925 →
Assignment of Assignor's Interest
Feb 22, 2023
From: TEYSSEYRE, JEROME; ESTACIO, MARIA CRISTINA; CABAHUG, ELSIE AGDON
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062768/0744 →
Security Interest
May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →