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App. No. 18/175,079 · Confirmation No. 7235

MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS

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2026-08-03 A.NA Amendment after Notice of Allowance (Rule 312) 2 View
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2026-05-05 SRFW Search information including classification, databases and other search related notes 2 View
2026-05-05 FWCLM Index of Claims 1 View
2026-05-05 SRNT Examiner's search strategy and results 20 View
2026-05-05 BIB Bibliographic Data Sheet 1 View
2026-01-12 A... Amendment/Request for Reconsideration-After Non-Final Rejection — View
2026-01-12 N417 Electronic Filing System Acknowledgment Receipt 2 View
2026-01-12 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2026-01-12 CLM Claims 6 View
2026-01-12 REM Applicant Arguments/Remarks Made in an Amendment 11 View
2025-10-16 CTNF Non-Final Rejection 25 View
2025-10-16 892 List of references cited by examiner 1 View
2025-10-16 FWCLM Index of Claims 1 View
2025-10-16 SRFW Search information including classification, databases and other search related notes 2 View
2025-10-16 1449 List of References cited by applicant and considered by examiner 4 View
2025-10-16 SRNT Examiner's search strategy and results 12 View
2025-10-16 1449 List of References cited by applicant and considered by examiner 4 View
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Quick Facts
App. No.
18/175,079
Filed
2023-02-27
Pub. No.
US20240290736A1
Art Unit
2814