IP Library Granted Patent US 12,610,818
Granted Patent B2
US 12,610,818 · App. 18/165,504 · Granted Apr 21, 2026

Single switch direct cooling assemblies and related methods

Inventors: Oseob Jeon (Seoul, KR); Yoonsoo Lee (Incheon, KR); Bosung Won (Seoul, KR); Youngsun Ko (Incheon, KR)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01L23/473H01L23/3672H01L23/49H05K7/20509
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Quick Facts
Patent No.
US 12,610,818
App. No.
18/165,504
Granted
Apr 21, 2026
Kind
B2
Abstract

Implementations of a dual sided cooling module may include a high side module coupled over a low side module through a coupling heat sink at a first largest planar surface of the high side module and at a first largest planar surface of the low side module; a high side heat sink coupled at a second largest planar surface of the high side module; and a low side heat sink coupled at a second largest planar surface of the low side module. A single cooling fluid may contact the coupling heat sink, the high side heat sink, and the low side heat sink.

Claims (17)

1 . A cooling assembly comprising:

at least two single switch modules coupled into corresponding openings in a support frame;

an upper jacket coupled to the support frame;

a lower jacket coupled to the support frame;

a coolant inlet coupled with the support frame; and

a coolant outlet coupled with the support frame;

wherein each of the at least two single switch modules comprises a high side module directly mechanically coupled over a low side module through a coupling heat sink at a first largest planar surface of the high side module and at a first largest planar surface of the low side module.

2 . The assembly of claim 1 , wherein the support frame comprises at least two flow pathways therein configured to direct cooling fluid to the coupling heat sink of each of the at least two single switch modules.

3 . The assembly of claim 1 , wherein the lower jacket and the upper jacket are coupled over the at least two single switch modules.

4 . The assembly of claim 1 , wherein the assembly is an immersion cooling module.

5 . The assembly of claim 1 , wherein the at least two single switch modules are configured to be single side cooled by a coolant passing from the coolant inlet to the coolant outlet.

6 . The assembly of claim 1 , wherein the at least two single switch modules are configured to be dual side cooled by a coolant passing from the coolant inlet to the coolant outlet.

7 . The assembly of claim 1 , wherein the high side module and the low side module are thermally coupled only through the coupling heat sink.

8 . The assembly of claim 1 , further comprising:

a high side heat sink coupled at a second largest planar surface of the high side module; and

a low side heat sink coupled at a second largest planar surface of the low side module;

wherein a single cooling fluid contacts the coupling heat sink, the high side heat sink, and the low side heat sink.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 064502, FRAME 0293 Recorded Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →
SECURITY INTEREST Recorded May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2023
From: JEON, OSEOB; KO, YOUNGSUN; LEE, YOONSOO; WON, BOSUNG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062613/0821 →