Jet impingement cooling with bypass fluid portion for high power semiconductor devices
A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.
1. A jet impingement cooling assembly for semiconductor devices, comprising:
an inlet chamber configured to receive an inlet fluid flow;
a jet plate having jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles;
an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles; and
at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.
2. The jet impingement cooling assembly for semiconductor devices of claim 1 , wherein the jet nozzles include at least a first subset of jet nozzles with diameters that decrease in a direction of the inlet fluid flow.
3. The jet impingement cooling assembly for semiconductor devices of claim 2 , wherein the jet nozzles include at least a second subset of jet nozzles with diameters that increase in the direction of the inlet fluid flow.
4. The jet impingement cooling assembly for semiconductor devices of claim 1 , wherein the at least one bypass nozzle includes at least two bypass nozzles.
5. The jet impingement cooling assembly for semiconductor devices of claim 1 , wherein at least one of the inlet chamber, the jet plate, or the outlet chamber includes polymer.
6. The jet impingement cooling assembly for semiconductor devices of claim 1 , further comprising a heat exchange base configured to receive a semiconductor module including at least one semiconductor device with a frontside facing away from the inlet chamber and a backside facing the jet plate.
7. The jet impingement cooling assembly for semiconductor devices of claim 6 , wherein the jet plate is positioned to cause jet impingement of the jet fluid portion through the jet nozzle and onto the backside of the at least one semiconductor device.
8. The jet impingement cooling assembly for semiconductor devices of claim 6 , wherein the semiconductor module is sealed to the heat exchange base using an adhesive.
9. The jet impingement cooling assembly for semiconductor devices of claim 6 , further comprising a mounting member configured to receive the semiconductor module and to be mounted on the heat exchange base.
10. The jet impingement cooling assembly for semiconductor devices of claim 9 , wherein the semiconductor module is sealed to the mounting member using at least one adhesive and the mounting member is sealed to the heat exchange base using the at least one adhesive.
11. A jet plate assembly for jet impingement cooling of a semiconductor device, comprising:
a jet plate having jet nozzles and at least one bypass nozzle formed therein, and configured to be received within a heat exchange base; and
wherein the jet plate, when received within the heat exchange base, divides a fluid flow path of an inlet fluid flow received at an inlet chamber of the heat exchange base into a jet fluid portion passing through the plurality of jet nozzles into an outlet chamber of the heat exchange base, and a bypass fluid portion passing through the at least one bypass nozzle into the outlet chamber, to thereby define an outlet fluid flow that includes the bypass fluid portion and the jet fluid portion.
12. The jet plate assembly of claim 11 , wherein at least one of the inlet chamber, the jet plate, the heat exchange base, or the outlet chamber includes polymer.
13. The jet plate assembly of claim 11 , wherein the heat exchange base is configured to receive a semiconductor module including at least one semiconductor device with a frontside facing away from the inlet chamber and a backside facing the jet plate.
14. The jet plate assembly of claim 13 , wherein the jet plate is positioned to cause jet impingement of the jet fluid portion through the jet nozzle and onto the backside of the at least one semiconductor device.
15. The jet plate assembly of claim 13 , wherein the semiconductor module is sealed to the heat exchange base using an adhesive.
16. The jet plate assembly of claim 13 , further comprising a mounting member configured to receive the semiconductor module and to be mounted on the heat exchange base, wherein the semiconductor module is sealed to the mounting member using at least one adhesive and the mounting member is sealed to the heat exchange base using the at least one adhesive.
17. A method of making a jet impingement cooling assembly for semiconductor devices, comprising:
forming an inlet chamber configured to receive an inlet fluid flow;
forming a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles;
forming an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles; and
forming at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.
18. The method of claim 17 , further comprising:
sealing at least one semiconductor power module to a heat exchange base that contains the inlet chamber, the outlet chamber, the jet plate, the at least one bypass nozzle, and the jet nozzles.
19. The method of claim 18 , further comprising:
mounting the at least one semiconductor power module onto a mounting member; and
sealing the at least one semiconductor power module to the heat exchange base by sealing the mounting member to the heat exchange base.
20. The method of claim 18 , wherein at least one of the inlet chamber, the jet plate, the heat exchange base, or the outlet chamber includes polymer.