Patent Assignment
Reel/Frame 062768/0744
Assignment of Assignor's Interest
Recorded: 2023-02-22
Pages: 4
Assignors
TEYSSEYRE, JEROME
Executed: 2019-08-13
ESTACIO, MARIA CRISTINA
Executed: 2019-07-26
CABAHUG, ELSIE AGDON
Executed: 2019-07-26
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Sic Mosfet Semiconductor Packages and Related Methods
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293
Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →