IP Library › Assignment 062670/0442
Patent Assignment
Reel/Frame 062670/0442

Assignment of Assignor's Interest

Recorded: 2023-02-13 Pages: 4
Assignors
YUN, CHANGSUN
Executed: 2023-02-09
JEON, OSEOB
Executed: 2023-02-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Jet Impingement Heatsink for High Power Semiconductor Devices
Application: 18/167,929 →
Publication: US 2024/0274506
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293 Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →