IP Library Assignment 062614/0674
Patent Assignment
Reel/Frame 062614/0674

Assignment of Assignor's Interest

Recorded: 2023-02-07 Pages: 8
Assignors
LER, HUI MIN
Executed: 2023-01-31
KHOR, SWEE HAR
Executed: 2023-01-31
CHANG, ZIMING
Executed: 2023-01-31
LAU, KOK YANG
Executed: 2023-01-30
ONG, HENG GIAP
Executed: 2023-01-31
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Packages with Wettable Flanks and Related Methods
Application: 18/165,545 →
Publication: US 2024/0266264
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293 Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →