IP Library Granted Patent US 12,279,061
Granted Patent B2
US 12,279,061 · App. 18/182,644 · Granted Apr 15, 2025

MIPI C-PHY and D-PHY interface with shared driver, equalization, and data path circuitry

Inventors: Jhankar Malakar (Corvallis, OR); Arindam Raychaudhuri (Bangalore, IN)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H04N25/766H04N25/767H04N25/7795H04L7/0087
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Quick Facts
Patent No.
US 12,279,061
App. No.
18/182,644
Granted
Apr 15, 2025
Kind
B2
Abstract

Imaging circuitry may include half-driver sub-circuits configured to support Mobile Industry Processor Interface (MIPI) D-PHY mode and C-PHY mode. Groups of two half-driver sub-circuits can be coupled together in the D-PHY mode, whereas groups of three half-driver sub-circuits can be coupled together in the C-PHY mode. Each half-driver sub-circuit can include one or more pull-up paths and one or more pull-down paths. Each half-driver sub-circuit can include multiple slices, a first portion of which can be operated to pull in a first direction and a second portion of which can be operated to pull in a second direction opposing the first direction to achieve the desired amount of equalization. The half-driver sub-circuits can be employed as the final driver stage of a shared data path architecture supporting both D-PHY and C-PHY modes. The shared data path can include serializers, pre-driver logic, and/or equalization enable blocks.

Claims (51)

1. Circuitry comprising:

a plurality of half-driver sub-circuits operable in

(1) a first mode in which the half-driver sub-circuits are coupled together in groups of two and

(2) a second mode in which the half-driver sub-circuits are coupled together in groups of three, wherein each half-driver sub-circuit in the plurality of half-driver sub-circuit comprises:

a pull-up path having one or more pull-up transistors, and

a pull-down path having one or more pull-down transistors.

2. The circuitry of claim 1 , wherein the first mode comprises a Mobile Industry Processor Interface (MIPI) D-PHY mode, and wherein the second mode comprises a Mobile Industry Processor Interface (MIPI) C-PHY mode.

3. The circuitry of claim 2 , wherein the pull-up path includes at least first and second pull-up transistors and wherein the pull-down path includes at least first and second pull-down transistors.

4. The circuitry of claim 3 , wherein the first and second pull-up transistors comprise first and second n-type transistors and wherein the first and second pull-down transistors comprise third and fourth n-type transistors.

5. The circuitry of claim 3 , wherein the pull-up path further comprises:

a first resistor coupled at a drain terminal of the first pull-up transistor;

a second resistor coupled at a source terminal of the first pull-up transistor;

a third resistor coupled at a drain terminal of the second pull-up transistor; and

a fourth resistor coupled at a source terminal of the second pull-up transistor.

6. The circuitry of claim 3 , wherein the pull-up path further comprises:

a first resistor coupled at a drain terminal of the first pull-down transistor;

a second resistor coupled at a source terminal of the first pull-down transistor;

a third resistor coupled at a drain terminal of the second pull-down transistor; and

a fourth resistor coupled at a source terminal of the second pull-down transistor.

7. The circuitry of claim 6 , wherein the first, second, third, and fourth resistors have the same resistance value.

8. The circuitry of claim 3 , wherein:

during a D-PHY low state and a C-PHY low state, the first and second pull-down transistors are turned on while the first and second pull-up transistors are turned off;

during a D-PHY high state and a C-PHY high state, the first and second pull-down transistors are turned off while the first and second pull-up transistors are turned on;

during a C-PHY mid state, the first pull-down transistor and the first pull-up transistor are turned off while the second pull-down transistor and the second pull-up transistors are turned on; and

during a C-PHY float state, the first and second pull-down transistors and the first and second pull-up transistors are turned off.

9. The circuitry of claim 2 , wherein each half-driver sub-circuit in the plurality of half-driver sub-circuits includes m number of slices and wherein to perform equalization during the D-PHY mode, (m−j) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling in a first direction while j slices in each half-driver in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling in a second direction opposite to the first direction.

10. The circuitry of claim 2 , wherein each half-driver sub-circuit in the plurality of half-driver sub-circuits includes m number of slices and wherein to perform a high state equalization during the C-PHY mode, (m−n) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling up while n slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling down.

11. The circuitry of claim 2 , wherein each half-driver sub-circuit in the plurality of half-driver sub-circuits includes m number of slices and wherein to perform a low state equalization during the C-PHY mode, (m−n) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling down while n slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling up.

12. The circuitry of claim 2 , wherein each half-driver sub-circuit in the plurality of half-driver sub-circuits includes m number of slices and wherein to perform a first mid state equalization during the C-PHY mode, (m/2) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling down while (m/2) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling up.

13. The circuitry of claim 2 , wherein each half-driver sub-circuit in the plurality of half-driver sub-circuits includes m number of slices and wherein to perform a second mid state equalization during the C-PHY mode, (m/2+n) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling up while (m/2−n) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling down.

14. The circuitry of claim 2 , wherein each half-driver sub-circuit in the plurality of half-driver sub-circuits includes m number of slices and wherein to perform a third mid state equalization during the C-PHY mode, (m/2+n) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling down while (m/2−n) slices in each half-driver sub-circuit in the plurality of half-driver sub-circuits are pulling up.

15. Circuitry comprising:

inputs configured to receive parallel data bits;

a plurality of serializers;

a plurality of half-driver sub-circuits operable in (1) a first mode in which the half-driver sub-circuits are coupled together in groups of two and (2) a second mode in which the half-driver sub-circuits are coupled together in groups of three;

first pre-driver logic coupled between the inputs and the plurality of serializers; and

second pre-driver logic coupled between the plurality of serializers and the plurality of half-driver sub-circuits.

16. The circuitry of claim 15 , wherein the first mode comprises a Mobile Industry Processor Interface (MIPI) D-PHY mode, wherein the second mode comprises a Mobile Industry Processor Interface (MIPI) C-PHY mode, wherein the inputs are configured to receive groups of 16-bit parallel data in the D-PHY mode and are configured to receive groups of 21-bit parallel data in the C-PHY mode, wherein the plurality of serializers comprises a plurality of 8-bit serializers, wherein each of the 8-bit serializers are fully in use in the D-PHY mode, and wherein each of the 8-bit serializers has an unused portion in the C-PHY mode.

17. The circuitry of claim 16 , wherein the first pre-driver logic is configured to operate as a bypass block in the D-PHY mode and uses combinational logic within the first pre-driver logic to convert the parallel data bits to C-PHY pre-driver inputs in the C-PHY mode.

18. The circuitry of claim 16 , wherein the second pre-driver logic is configured to operate as a bypass block in the C-PHY mode and uses combinational logic within the second pre-driver logic to convert serialized data bits output from the plurality of serializers to complementary D-PHY pre-driver inputs in the D-PHY mode, and wherein the second pre-driver logic comprises a plurality of multiplexers configured to selectively bypass the combinational logic in the C-PHY mode.

19. The circuitry of claim 16 , further comprising:

equalization enable circuitry coupled between the second pre-driver logic and the plurality of half-driver sub-circuits, wherein the equalization enable circuitry is configured to operate a first portion of each half-driver sub-circuit to pull in a first direction and to operate a second portion of each half-driver sub-circuit to pull in a second direction opposing the first direction.

20. The circuitry of claim 15 , wherein each half-driver sub-circuit in the plurality of half-driver sub-circuits comprises:

a first pull-up transistor;

a second pull-up transistor;

a first pull-down transistor;

a second pull-down transistor;

first and second resistors coupled at drain and source terminals of the first pull-up transistor;

second and fourth resistors coupled at drain and source terminals of the second pull-up transistor;

fifth and sixth resistors coupled at drain and source terminals of the first pull-down transistor; and

seventh and eighth resistors coupled at drain and source terminals of the second pull-down transistor.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 064502, FRAME 0293 Recorded Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →
SECURITY INTEREST Recorded May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2023
From: MALAKAR, JHANKAR; RAYCHAUDHURI, ARINDAM
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063216/0508 →
Continuity (1)
Related Publication 20240314466A1 · Sep 19, 2024
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