IP Library Granted Patent US 12,556,793
Granted Patent B2
US 12,556,793 · App. 18/183,106 · Granted Feb 17, 2026

Nanophotonic high dynamic range sensor pixel

Inventors: Radu Ispasoiu (Santa Clara, CA); Swarnal Borthakur (Boise, ID); Byounghee Lee (Boise, ID)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H04N23/55H04N25/13
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Quick Facts
Patent No.
US 12,556,793
App. No.
18/183,106
Granted
Feb 17, 2026
Kind
B2
Abstract

Image sensor pixels, imaging systems, and methods for constructing image sensor pixels. The image sensor pixel includes a high-light photodetector, a plurality of low-light photodetectors, and a spectral router. The plurality of low-light photodetectors is positioned around the high-light photodetector. The spectral router is positioned above the high-light photodetector and the plurality of low-light photodetectors. The spectral router is configured to route a portion of light received at the spectral router to one or more of the plurality of low-light photodetectors.

Claims (40)

1 . An image sensor pixel, comprising:

a high-light photodetector;

a plurality of low-light photodetectors positioned around the high-light photodetector;

a first spectral router positioned above the high-light photodetector and the plurality of low-light photodetectors, wherein the first spectral router is configured to route photons of selected wavelengths received at the first spectral router to one or more of the plurality of low-light photodetectors and away from the high-light photodetector;

a second spectral router positioned above the first spectral router; and

a third spectral router positioned between the first spectral router and the second spectral router, wherein a lower surface of the third spectral router is in contact, in its entirety, with an upper surface of the first spectral router, and wherein an upper surface of the third spectral router is in contact, in its entirety, with a lower surface of the second spectral router.

2 . The image sensor pixel of claim 1 , wherein the second spectral router is configured to:

route photons of a first wavelength received at the second spectral router to the first spectral router, and

route photons of a second wavelength received at the second spectral router to one or more neighboring image sensor pixels.

3 . The image sensor pixel of claim 2 , wherein the third spectral router is configured to collimate the photons of the first wavelength prior to entering the first spectral router.

4 . The image sensor pixel of claim 1 , wherein the high-light photodetector and the plurality of low-light photodetectors each include a collection surface, wherein a size of the collection surface of the high-light photodetector is different than a size of the collection surface of one of the plurality of low-light photodetectors.

5 . The image sensor pixel of claim 1 , wherein the image sensor pixel is integrated into a silicon substrate.

6 . An imaging system comprising:

a lens system;

an imaging controller;

and an image sensor in operational relationship with the lens system and electrically coupled to the imaging controller, wherein the image sensor including an array of image sensor pixels, wherein each of the image sensor pixels includes:

a high-light photodetector, a plurality of low-light photodetectors positioned around the high-light photodetector,

a first spectral router positioned above the high-light photodetector and the plurality of low-light photodetectors, wherein the first spectral router is configured to route photons of selected wavelengths received at the first spectral router of one or more of the plurality of low-light photodetectors and away from the high-light photodetector,

and a spectral filter positioned above the first spectral router, wherein a lower surface of the spectral filter is in contact, in its entirety, with an upper surface of the first spectral router.

7 . The imaging system of claim 6 , wherein the spectral filter of each of the image sensors is configured to:

direct photons of a first wavelength received at the spectral filter to the first spectral router, and

block photons of a second wavelength received at the spectral filter.

8 . The imaging system of claim 7 , wherein each of the image sensor pixels further includes a second spectral router configured to collimate the photons of the first and second wavelengths prior to entering the spectral filter, and wherein the spectral filter is positioned between the first spectral router and the second spectral router, and wherein a lower surface of the second spectral router is in contact in its entirety with an upper surface of the spectral filter.

9 . The imaging system of claim 6 , wherein the high-light photodetector and the plurality of low-light photodetectors each include a collection surface, wherein a size of the collection surface of the high-light photodetector is different than a size of the collection surface of one of the plurality of low-light photodetectors.

10 . The imaging system of claim 6 , wherein the imaging system is at least one selected from the group consisting of an automobile, a vehicle, a camera, a cellular telephone, a tablet computing, a webcam, a video camera, a video surveillance system, and a video gaming system.

11 . The image sensing system of claim 8 , wherein a lower surface of the spectral filter is in contact in its entirety with an upper surface of the first spectral router.

12 . The image sensing system of claim 6 , wherein each of the image sensor pixels are integrated into a silicon substrate.

13 . The image sensing system of claim 12 , wherein each of the image sensor pixels further comprises a microlens positioned above the spectral filter, wherein a lower surface of the microlens is in contact, in its entirety, with an upper surface of the spectral filter, wherein the microlens comprises a convex upper surface, and wherein the microlens is configured to collimate light entering the spectral filter.

14 . The image sensing system of claim 6 , wherein the high-light photodetector of each of the image pixel sensors comprises an inner region in contact with the first spectral router, and wherein the plurality of low-light photodetectors of each of the image sensor pixels further comprise a plurality of outer regions surrounding the inner region.

15 . An image sensor pixel, comprising:

a high-light photodetector;

a plurality of low-light photodetectors positioned around the high-light photodetector;

a microlens positioned above the high-light photodetector and the plurality of low-light photodetectors;

a spectral filter positioned above the high-light photodetector and the plurality of low-light photodetectors and below the microlens, wherein a lower surface of the microlens is in contact, in its entirety, with an upper surface of the spectral filter, and wherein the spectral filter is configured to allow photons of a first wavelength through spectral filter and further configured to block photons of a second wavelength; and

a spectral router positioned above the high-light photodetector and the plurality of low-light photodetectors and below the spectral filter, wherein an upper surface of the spectral router is in contact, in its entirety, with a lower surface of the spectral filter.

16 . The image sensor pixel of claim 15 , wherein the microlens comprises a convex upper surface, and wherein the microlens is configured to collimate light entering the spectral filter.

17 . The image sensor pixel of claim 15 , wherein the image sensor pixel is integrated into a silicon substrate.

18 . The image sensor pixel of claim 15 , wherein the spectral router is configured to route photons of selected wavelengths received at the spectral router of one or more of the plurality of low-light photodetectors and away from the high-light photodetector.

19 . The image sensor pixel of claim 15 , wherein the high-light photodetector and the plurality of low-light photodetectors each include a collection surface, wherein a size of the collection surface of the high-light photodetector is different than a size of the collection surface of one of the plurality of low-light photodetectors.

20 . The image sensor pixel of claim 15 , wherein the high-light photodetector comprises an inner region in contact with the spectral router, and wherein the plurality of low-light photodetectors further comprise a plurality of outer regions surrounding the inner region and in contact with the spectral router.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 064502, FRAME 0293 Recorded Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →
SECURITY INTEREST Recorded May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2023
From: ISPASOIU, RADU; BORTHAKUR, SWARNAL; LEE, BYOUNGHEE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063044/0299 →
Continuity (1)
Related Publication 20240314417A1 · Sep 19, 2024
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