Substrates and related methods
Implementations of a substrate may include an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side; a first electrically conductive layer coupled to the first largest planar side and including a first scalloped edge having a first pattern; and a second electrically conductive layer coupled to the second largest planar side and including a second scalloped edge having a second pattern. The first pattern and the second pattern may alternate along at least one edge of the first largest planar side and at least one edge of the second largest planar side, respectively.
1. A substrate comprising:
an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side;
a first electrically conductive layer coupled to the first largest planar side and comprising a first scalloped edge having a first pattern; and
a second electrically conductive layer coupled to the second largest planar side and comprising a second scalloped edge having a second pattern;
wherein the first pattern and the second pattern alternate along at least one edge of the first largest planar side and at least one edge of the second largest planar side, respectively.
2. The substrate of claim 1 , wherein the first pattern is periodic.
3. The substrate of claim 1 , wherein the second pattern is periodic.
4. The substrate of claim 1 , wherein the first pattern comprises repeating angular projections.
5. The substrate of claim 1 , wherein the second pattern comprises repeating angular projections.
6. The substrate of claim 2 , wherein the second pattern is periodic.
7. The substrate of claim 4 , wherein the second pattern comprises repeating angular projections.
8. A substrate comprising:
an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side;
a first electrically conductive layer coupled to the first largest planar side and comprising a first scalloped edge having a first pattern; and
a second electrically conductive layer coupled to the second largest planar side and comprising a second scalloped edge having a second pattern, the second pattern alternating with the first pattern.
9. The substrate of claim 8 , wherein the first pattern is periodic.
10. The substrate of claim 8 , wherein the second pattern is periodic.
11. The substrate of claim 8 , wherein the first pattern comprises repeating angular projections.
12. The substrate of claim 8 , wherein the second pattern comprises repeating angular projections.
13. The substrate of claim 9 , wherein the second pattern is periodic.
14. The substrate of claim 11 , wherein the second pattern comprises repeating angular projections.
15. A substrate comprising:
an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side;
a first electrically conductive layer coupled to the first largest planar side and comprising a first scalloped edge having a first sinusoidal pattern; and
a second electrically conductive layer coupled to the second largest planar side and comprising a second scalloped edge having a second sinusoidal pattern;
wherein the first sinusoidal pattern and the second sinusoidal pattern alternate along at least one edge of the first largest planar side and at least one edge of the second largest planar side, respectively.
16. The substrate of claim 15 , wherein the first sinusoidal pattern is 180 degrees out of phase with the second sinusoidal pattern.
17. The substrate of claim 15 , wherein the first scalloped edge overlaps the second scalloped edge only at recessed locations of the first scalloped edge and recessed locations of the second scalloped edge.