Patent Assignment
Reel/Frame 062315/0522
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 6
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1188, HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Flexible Printed Circuit and Manufacturing Method Thereof, Electronic Device Module and Electronic Device