Patent Assignment
Reel/Frame 062316/0149
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 4
Assignors
HUANG, MAO-LIN
Executed: 2022-09-26
CHU, LUNG-KUN
Executed: 2022-09-26
HSU, CHUNG-WEI
Executed: 2022-09-26
CHIANG, KUO-CHENG
Executed: 2022-09-29
WANG, CHIH-HAO
Executed: 2022-10-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Manufacturing the Same