Patent Assignment
Reel/Frame 062317/0867
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 4
Assignors
YEH, TSUNG-HAO
Executed: 2022-09-28
LIU, CHIEN HUNG
Executed: 2022-09-26
CHEN, HSIEN JUNG
Executed: 2022-09-28
WANG, HSIN HENG
Executed: 2022-09-26
HUANG, KUO-CHING
Executed: 2022-10-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(2)
Semiconductor Die Package and Methods of Formation
Application:
18/151,084 →
Publication:
US 2024/0105644
Semiconductor Die Package and Methods of Formation
Application:
63/377,418 →