Patent Assignment
Reel/Frame 062320/0864
Corrective Assignment to Correct the the Conveying Party Data Previously Recorded at Reel: 053339 Frame: 0149. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2022-10-06
Pages: 6
Assignors
ZHANG, LIN
Executed: 2020-01-08
DUAN, HUO YUN
Executed: 2020-01-08
LI, XI LIN
Executed: 2020-01-08
XIONG, CHEN
Executed: 2020-01-08
KANG, XIAO LIN
Executed: 2020-01-08
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULVEARD, DALLAS, TEXAS, 75243
Covered Property
(1)
Copper Wire Bond on Gold Bump on Semiconductor Die Bond Pad
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 29, 2020
From: ZHANG, LIN; DUAN, HUO YUN; LI, XI LIN; XIONG, CHEN
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 053339/0149 →
Corrective Assignment to Correct the Conveying Party Previously Recorded on Reel 053339 Frame 0149. Assignor(S) Hereby Confirms the Assignment.
Jan 9, 2023
From: ZHANG, LIN; DUAN, HUO YUN; LI, XI LIN; XIONG, CHEN
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 062325/0818 →