IP Library Assignment 062325/0771
Patent Assignment
Reel/Frame 062325/0771

Assignment of Assignor's Interest

Recorded: 2023-01-10 Pages: 6
Assignors
LEE, DOOHYUN
Executed: 2022-12-22
SHIN, HEONJONG
Executed: 2022-12-22
KIM, SEON-BAE
Executed: 2022-12-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Devices Including Conductive Structures
Application: 18/095,080 →
Publication: US 2023/0402376