Patent Assignment
Reel/Frame 062329/0299
Assignment of Assignor's Interest
Recorded: 2023-01-10
Pages: 12
Assignors
VENKATRAMANI, RAJAGOPALAN
Executed: 2022-11-01
MARTINEZ, LIANE
Executed: 2022-10-31
WONG, GABRIEL
Executed: 2022-11-09
GADDI, RENATO DIMATULA
Executed: 2022-10-31
Assignees
ADVANCED MICRO DEVICES, INC.
2485 AUGUSTINE DRIVE, SANTA CLARA, CALIFORNIA, 95054
ATI TECHNOLOGIES ULC
ONE COMMERCE DRIVE EAST, MARKHAM, L3T 7X6, CANADA
Covered Property
(1)
Systems and Methods for Generating a Floorplan and Bump Placement for a Package Design
Patent:
12,499,300 →
Application:
17/978,071 →