Patent Assignment
Reel/Frame 062332/0464
Assignment of Assignor's Interest
Recorded: 2023-01-10
Pages: 4
Assignors
WANG, JENG-AN
Executed: 2023-01-09
LEE, CHIEN-HSUN
Executed: 2023-01-09
HOU, HAO-CHENG
Executed: 2023-01-09
WANG, TSUNG-DING
Executed: 2023-01-09
LIN, SHENG-CHI
Executed: 2023-01-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Three-Dimensional Semiconductor Device and Method