Patent Assignment
Reel/Frame 062335/0381
Assignment of Assignor's Interest
Recorded: 2023-01-11
Pages: 3
Assignors
LEE, CHIA CHEN
Executed: 2022-09-06
WU, CHIA-TIEN
Executed: 2022-09-06
PENG, SHIH-WEI
Executed: 2022-09-14
CHEN, KUAN YU
Executed: 2022-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Connecting Structure Comprising Isolation Between Connecting Vias and Method for Forming the Same
Application:
18/152,784 →
Publication:
US 2024/0088019