Patent Assignment
Reel/Frame 062357/0214
Assignment of Assignor's Interest
Recorded: 2023-01-12
Pages: 4
Assignors
CHUNG, CHIA-LING
Executed: 2022-11-06
CHENG, CHUN-CHIH
Executed: 2022-11-01
CHUANG, YING-LIANG
Executed: 2022-11-01
YEH, MING-HSI
Executed: 2022-11-01
HUANG, KUO-BIN
Executed: 2022-11-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6,, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof