Patent Assignment
Reel/Frame 062359/0841
Assignment of Assignor's Interest
Recorded: 2023-01-12
Pages: 3
Assignor
JIN, JISONG
Executed: 2023-01-04
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Packaging Structure and Packaging Method
Application:
18/096,088 →
Publication:
US 2023/0352467