Patent Assignment
Reel/Frame 062360/0134
Assignment of Assignor's Interest
Recorded: 2023-01-12
Pages: 5
Assignors
KUO, HUNG-YI
Executed: 2022-11-20
YU, CHEN-HUA
Executed: 2022-12-31
YEE, KUO-CHUNG
Executed: 2022-11-20
LIEN, YU-JEN
Executed: 2022-11-20
SHEN, KE-HAN
Executed: 2022-11-28
SHENG, WEI-KONG
Executed: 2022-11-20
LIU, CHUNG-SHI
Executed: 2022-11-21
LU, SZU-WEI
Executed: 2022-11-25
TSAI, TSUNG-FU
Executed: 2022-11-20
LEE, CHUNG-JU
Executed: 2022-11-23
KE, CHIH-MING
Executed: 2022-11-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package with Improved Heat Dissipation Efficiency and Method for Forming the Same
Application:
18/152,615 →
Publication:
US 2024/0162109