Patent Assignment
Reel/Frame 062370/0061
Assignment of Assignor's Interest
Recorded: 2023-01-13
Pages: 6
Assignors
SHIN, KEUNWOOK
Executed: 2023-01-04
LEE, EUNKYU
Executed: 2023-01-04
LEE, CHANGSEOK
Executed: 2023-01-04
KIM, CHANGHYUN
Executed: 2023-01-04
BYUN, KYUNG-EUN
Executed: 2023-01-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Metal-2 Dimensional Material-Semiconductor Junction
Application:
18/151,775 →
Publication:
US 2023/0343846