Patent Assignment
Reel/Frame 062373/0190
Assignment of Assignor's Interest
Recorded: 2023-01-13
Pages: 5
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Manufacturing Methods for Copper-Clad Laminate and Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.