Patent Assignment
Reel/Frame 062374/0712
Assignment of Assignor's Interest
Recorded: 2023-01-13
Pages: 4
Assignors
BAE, BUMHEE
Executed: 2022-12-21
SEONG, YOUNGHUN
Executed: 2022-12-21
LEE, JAEHOON
Executed: 2022-12-21
CHEON, JEONGNAM
Executed: 2022-12-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Flexible Printed Circuit Board Assembly and Electronic Device Including the Same