Patent Assignment
Reel/Frame 062379/0872
Assignment of Assignor's Interest
Recorded: 2023-01-16
Pages: 3
Assignors
HU, CHU-WEI
Executed: 2023-01-04
HUANG, CHIEN-KAI
Executed: 2023-01-04
LU, TIEN-YU
Executed: 2023-01-04
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Device with Integrated Deep Trench Capacitors
Application:
18/097,296 →
Publication:
US 2023/0260894