Patent Assignment
Reel/Frame 062384/0659
Assignment of Assignor's Interest
Recorded: 2023-01-16
Pages: 3
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.