Patent Assignment
Reel/Frame 062389/0503
Assignment of Assignor's Interest
Recorded: 2023-01-17
Pages: 6
Assignors
CHUNG, CHI-HSIEN
Executed: 2022-08-18
WANG, TZU-JUI
Executed: 2022-08-15
WANG, CHEN-JONG
Executed: 2022-08-15
HSU, TZU-HSUAN
Executed: 2023-01-14
YAUNG, DUN-NIAN
Executed: 2022-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stacked Cmos Image Sensor and Method of Manufacturing the Same
Application:
17/887,634 →
Publication:
US 2023/0411431