Patent Assignment
Reel/Frame 062400/0718
Assignment of Assignor's Interest
Recorded: 2023-01-17
Pages: 3
Assignors
FENG, YICHENG
Executed: 2023-01-10
HUANG, YUHENG
Executed: 2023-01-10
CHEN, BANG
Executed: 2023-01-10
SONG, SHENGJIN
Executed: 2023-01-10
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, CHINA
Covered Property
(1)
Method for Stacking Multi-Layer Wafers, and System for Stacking Mult-Layer Wafers
Application:
18/155,712 →
Publication:
US 2023/0154805