Patent Assignment
Reel/Frame 062411/0410
Assignment of Assignor's Interest
Recorded: 2023-01-18
Pages: 6
Assignors
PARK, SUNG HWAN
Executed: 2022-08-30
PARK, JUHYEON
Executed: 2022-08-30
KIM, HYUNWOO
Executed: 2022-09-05
HONG, SUK KOO
Executed: 2022-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Photosensitive Polymer, Photoresist Composition Including the Same, and Method of Fabricating Semiconductor Device
Application:
18/154,184 →
Publication:
US 2023/0296983