IP Library › Assignment 062415/0434
Patent Assignment
Reel/Frame 062415/0434

Assignment of Assignor's Interest

Recorded: 2023-01-18 Pages: 5
Assignors
NIIDA, KEISUKE
Executed: 2023-01-05
SAWAMURA, TAKASHI
Executed: 2023-01-05
KORI, DAISUKE
Executed: 2023-01-05
TACHIBANA, SEIICHIRO
Executed: 2023-01-05
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0005, JAPAN
Covered Property (1)
Composition for Forming Protective Film Against Alkaline Aqueous Hydrogen Peroxide, Substrate for Producing Semiconductor Apparatus, Method for Forming Protective Film, and Method for Forming Pattern
Application: 18/156,089 →
Publication: US 2023/0260787