Assignment of Assignor's Interest

Recorded: 2023-01-19 Pages: 8

Assignors

KWON, JUNYOUNG

Executed: 2022-07-14

BYUN, KYUNG-EUN

Executed: 2022-07-14

SEOL, MINSU

Executed: 2022-07-14

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Device Comprising Two-Dimensional Material and Method of Manufacturing the Semiconductor Device

Application: 18/154,978 →

Publication: US 2023/0275128

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.