Patent Assignment
Reel/Frame 062424/0919
Assignment of Assignor's Interest
Recorded: 2023-01-19
Pages: 4
Assignors
LIN, MENG-HAN
Executed: 2020-11-19
YEONG, SAI-HOOI
Executed: 2020-11-19
CHIA, HAN-JONG
Executed: 2020-11-19
WANG, CHENCHEN JACOB
Executed: 2020-11-19
LIN, YU-MING
Executed: 2020-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device, Integrated Circuit Device and Method