Patent Assignment
Reel/Frame 062429/0358
Assignment of Assignor's Interest
Recorded: 2023-01-19
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Methods of Forming the Same
Application:
18/099,229 →
Publication:
US 2024/0105591