Patent Assignment
Reel/Frame 062429/0456
Assignment of Assignor's Interest
Recorded: 2023-01-19
Pages: 4
Assignors
KWON, MYUNG JAE
Executed: 2023-01-13
NAM, SANG HYUCK
Executed: 2023-01-11
PARK, JIN HYOUNG
Executed: 2023-01-11
Assignee
LG INNOTEK CO., LTD.
30, MAGOKJUNGANG 10-RO, GANGSEO-GU, SEOUL, 07796, KOREA, REPUBLIC OF
Covered Property
(1)
A Circuit Board Including a Core Layer Provided with Plurality of Insulating Layers