Assignment of Assignor's Interest

Recorded: 2023-01-20 Pages: 3

Assignors

DENG, QINGWEN

Executed: 2023-01-18

ZHANG, KUN

Executed: 2023-01-18

LI, SHUNBIN

Executed: 2023-01-18

ZHANG, RUYUN

Executed: 2023-01-18

Assignee

ZHEJIANG LAB

ZHEJIANG LAB NANHU HEADQUARTERS, YUHANG DISTRICT, HANGZHOU CITY, ZHEJIANG PROVINCE, P.R. 311121 CHINA, HANGZHOU, CHINA

Covered Property (1)

Interconnection Structure of System on Wafer and Pcb Base on Tsv Process and Method for Manufacturing the Same

Patent: 11,705,437 →

Application: 18/098,726 →