Patent Assignment
Reel/Frame 062432/0692
Assignment of Assignor's Interest
Recorded: 2023-01-20
Pages: 8
Assignors
IWASHITA, YASUNORI
Executed: 2023-01-10
ARAI, SHINYA
Executed: 2022-10-25
NAKATSUKA, KEISUKE
Executed: 2023-01-10
ASHIDATE, HIROAKI
Executed: 2023-01-10
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device, Wafer, and Wafer Manufacturing Method