IP Library › Assignment 062447/0872
Patent Assignment
Reel/Frame 062447/0872

Assignment of Assignor's Interest

Recorded: 2023-01-23 Pages: 3
Assignor
YAMAUCHI, AKIRA
Executed: 2019-07-07
Assignee
BONDTECH CO., LTD.
77, KISSHOIN-ISHIHARANISHI-MACHI, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8366, JAPAN
Covered Property (1)
Resin Shaping Device
Application: 18/157,147 →
Publication: US 2023/0154770