Patent Assignment
Reel/Frame 062455/0288
Assignment of Assignor's Interest
Recorded: 2023-01-23
Pages: 3
Assignor
LIAW, JHON JHY
Executed: 2023-01-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof
Application:
18/157,607 →
Publication:
US 2024/0250027