Patent Assignment
Reel/Frame 062456/0391
Assignment of Assignor's Interest
Recorded: 2023-01-23
Pages: 4
Assignors
LIN, SHIH-YAO
Executed: 2021-04-05
LEE, HSIAO WEN
Executed: 2021-05-09
CHENG, YU-SHAN
Executed: 2021-04-05
CHEN, CHAO-CHENG
Executed: 2021-04-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing Thereof