Patent Assignment
Reel/Frame 062463/0980
Assignment of Assignor's Interest
Recorded: 2023-01-24
Pages: 5
Assignee
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
222, WANGSIMNI-RO SEONGDONG-GU, SEOUL, 04763, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Flash Memory Having Improved Integration Density
Application:
18/005,929 →
Publication:
US 2023/0276631