Patent Assignment
Reel/Frame 062515/0397
Assignment of Assignor's Interest
Recorded: 2023-01-27
Pages: 6
Assignors
HA, DAEWON
Executed: 2023-01-09
LEE, KYUNGHWAN
Executed: 2023-01-09
HWANG, YOUNGNAM
Executed: 2023-01-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device
Application:
18/102,349 →
Publication:
US 2023/0380176